| 摘要 |
A power module (20) includes one or more semiconductor power devices (22) having a power overlay (POL) (24) bonded thereto. A first heat sink assembly (30), is bonded to the semiconductor power devices (22) on a side opposite the POL (24). A second heat sink assembly (28) is bonded to the POL (24) opposite the side of the POL (24) bonded to the semiconductor power devices (24). The semiconductor power devices (22), POL (24), first channel heat sink assembly (30), and second channel heat sink assembly (28) together form a double side cooled power overlay module. The second channel heat sink assembly (28) is bonded to the POL (24) solely via a compliant thermal interface material (26) without the need for planarizing, brazing or metallurgical bonding. |
