发明名称 Light emitting device package
摘要 <p>The invention relates to a light emitting device package (100), comprising: a body (110 having a cavity (114) formed therein; a lead frame (131, 132) that penetrates the body and extends in the cavity such that an outside surface of the lead frame comprises a first surface exposed to the cavity, a contact surface in contact with the body and a second surface not exposed to the cavity and not in contact with the body; a metal layer (145) provided only on the second surface and at least between the body and the second surface; and a light emitting device (120) provided in the cavity and electrically coupled to the lead frame.</p>
申请公布号 EP2228842(A2) 申请公布日期 2010.09.15
申请号 EP20100155808 申请日期 2010.03.08
申请人 LG INNOTEK CO., LTD. 发明人 KIM, KI BUM
分类号 H01L33/48;H01L33/62 主分类号 H01L33/48
代理机构 代理人
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