APPARATUS FOR WAFER GRINDING AND METHOD FOR THE SAME

摘要

PURPOSE: A wafer grinding apparatus and a method thereof are provided to improve the productivity of polishing by reducing the thickness of a mechanical damage layer generated during a wafer grinding process. CONSTITUTION: An elevation unit(5) elevates a frame(4) for a chuck(9). A rotation motor(2) is installed on a frame to rotate a grinding wheel(1). A supporting member(30) supports inner cases(3a, 3b) to enable sliding. A piezoelectric element member(50) is installed between the rotation motor and the frame.