| 摘要 |
Exposure equipment having a wafer pre-alignment apparatus and a wafer pre-alignment method using the same reduce wafer pre-alignment errors. The exposure equipment comprises a plurality of exposure units in which lots of wafers are loaded, respectively, and a central control unit. The exposure units are constituted by an alignment apparatus that can detect the relative angular orientation of each wafer transferred to the apparatus and thus, sense any misalignment of the wafers. The central control unit calculates inherent error values for the exposure units based on data transmitted to the central control unit from the alignment apparatus. The central control unit also controls the equipment based on the inherent error values of the exposure units to compensate for the misalignment of the wafers in the exposure units.
|
