发明名称 Cationically curable epoxy resin composition
摘要 The objective of the present invention is to provides a cationically curable epoxy resin composition excellent in sealing and adhesive property specifically to glass, excellent reflow resistance property, moisture resistance and water resistance while keeping a good workability intrinsic to a light curable resins. The invention provides a cationically curable epoxy resin composition comprising: (a) an epoxy resin component; (b) a cationic photo-initiator; (c) a cationic thermal-initiator and (d) a filler selected from the group consisting of oxides, hydroxides and carbonates containing a Group II element in the long periodic table.
申请公布号 US7795744(B2) 申请公布日期 2010.09.14
申请号 US20040596611 申请日期 2004.12.16
申请人 HENKEL CORPORATION 发明人 CHEN CHUNFU;GAN YOKE AI
分类号 H01L23/29;B32B27/20;B32B27/26;B32B27/38;C08G59/18;C08G59/68;C08L63/00 主分类号 H01L23/29
代理机构 代理人
主权项
地址