发明名称 Wafer based camera module and method of manufacture
摘要 An integrated camera module (10, 10a) for capturing video images in very small digital cameras, cell phones, personal digital assistants, and the like. A lens assembly (24, 24a) is rigidly affixed in relation to a sensor array area (14) of a camera chip (12) by a molding (26). The molding (26) is formed on the camera chip (12), and optionally on a printed circuit board (16, 16a) on which the camera chip (12) is mounted. The lens assembly (24, 24a) is held in place in a recess (29) of the molding (26) by an adhesive (28). The molding (26) is formed such that a precise gap (30) exists between the lens assembly (24) and a sensor array area (14) of the camera chip (12). In a particular embodiment, lens holders (306, 506) are formed entirely on the camera chips (302, 502) before or after they are separated from one another.
申请公布号 US7796187(B2) 申请公布日期 2010.09.14
申请号 US20050247993 申请日期 2005.10.11
申请人 FLEXTRONICS AP LLC 发明人 SHANGGUAN DONGKAI;KALE VIDYADHAR SITARAM;TAM SAMUEL WAISING
分类号 H04N5/225;H01L27/146;H01L31/0232 主分类号 H04N5/225
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