发明名称 Electrical enclosure cooling structure assembly and method
摘要 An electrical enclosure assembly comprises an enclosure having walls defining an interior space for housing electrical components and having a front flange surrounding a front opening. A cover is hingedly mounted to the enclosure for selectively closing the front opening. The cover comprises a front wall larger than the front opening and a rearwardly extending peripheral rim. Cooling structure is integrally formed on an interior surface of the cover proximate the peripheral rim. The cooling structure comprises a plurality of spaced apart cooling ribs each having a shoulder engaging the enclosure front flange when the cover is in a closed position to provide an air flow path between the interior space and outside of the enclosure through spaces between the cooling ribs.
申请公布号 US7796376(B2) 申请公布日期 2010.09.14
申请号 US20080009299 申请日期 2008.01.17
申请人 YASKAWA AMERICA, INC. 发明人 CAIRO JOHN ALAN;FLEIG TYLER;NEMEC BRUCE CARL
分类号 H05K7/20;H05K5/00 主分类号 H05K7/20
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