发明名称 |
Electrical enclosure cooling structure assembly and method |
摘要 |
An electrical enclosure assembly comprises an enclosure having walls defining an interior space for housing electrical components and having a front flange surrounding a front opening. A cover is hingedly mounted to the enclosure for selectively closing the front opening. The cover comprises a front wall larger than the front opening and a rearwardly extending peripheral rim. Cooling structure is integrally formed on an interior surface of the cover proximate the peripheral rim. The cooling structure comprises a plurality of spaced apart cooling ribs each having a shoulder engaging the enclosure front flange when the cover is in a closed position to provide an air flow path between the interior space and outside of the enclosure through spaces between the cooling ribs.
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申请公布号 |
US7796376(B2) |
申请公布日期 |
2010.09.14 |
申请号 |
US20080009299 |
申请日期 |
2008.01.17 |
申请人 |
YASKAWA AMERICA, INC. |
发明人 |
CAIRO JOHN ALAN;FLEIG TYLER;NEMEC BRUCE CARL |
分类号 |
H05K7/20;H05K5/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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