发明名称 Image sensor module, method of manufacturing the same, and camera module using the same
摘要 The present invention relates to a method of manufacturing an image sensor module including attaching an image sensor on one side of a double-sided flexible printing circuit board (FPCB) provided with a window such that the image sensor module covers the window; and mounting at least one electric part on the other side of the double-sided FPCB on which the image sensor is attached.
申请公布号 US7796882(B2) 申请公布日期 2010.09.14
申请号 US20060507477 申请日期 2006.08.22
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM HO KYOUM;NAM HYOUNG WOO
分类号 G03B17/00;H04N5/225;H04N5/335 主分类号 G03B17/00
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