发明名称 |
Image sensor module, method of manufacturing the same, and camera module using the same |
摘要 |
The present invention relates to a method of manufacturing an image sensor module including attaching an image sensor on one side of a double-sided flexible printing circuit board (FPCB) provided with a window such that the image sensor module covers the window; and mounting at least one electric part on the other side of the double-sided FPCB on which the image sensor is attached.
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申请公布号 |
US7796882(B2) |
申请公布日期 |
2010.09.14 |
申请号 |
US20060507477 |
申请日期 |
2006.08.22 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM HO KYOUM;NAM HYOUNG WOO |
分类号 |
G03B17/00;H04N5/225;H04N5/335 |
主分类号 |
G03B17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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