发明名称 Wiring substrate, electro optic device and electronic equipment
摘要 A wiring substrate includes; a wiring composed of a conductive film and formed on a substrate; and an insulating layer, wherein the insulating layer is arbitrarily arranged among the conductive films.
申请公布号 US7795796(B2) 申请公布日期 2010.09.14
申请号 US20060330172 申请日期 2006.01.12
申请人 SEIKO EPSON CORPORATION 发明人 KAMAKURA TOMOYUKI
分类号 H01J1/62 主分类号 H01J1/62
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