| 摘要 |
PURPOSE: A semiconductor package module and a method for manufacturing the same are provided to prevent the separation between the semiconductor package module and a heat sink by firmly fixing the heat sink to the semiconductor package using fixing material. CONSTITUTION: A semiconductor package(20) includes a semiconductor chip(22) and a molding material(24) which covers the semiconductor chip. The semiconductor package is electrically connected with the circuit pattern(4) of a circuit substrate(10) using a connection material(26). A heat radiating unit(30) includes an opening which exposes the molding material. A first fixing unit(42) is combined with the molding material through the opening. A second fixing unit(44) is integrated with the first fixing unit and is fixed to the heat radiating unit.
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