发明名称 |
METAL NANOPARTICLE COMPOSITION WITH IMPROVED ADHESION |
摘要 |
A composition that may be used for an electronic circuit element includes a metal nanoparticle, an adhesion promoter compound and a solvent. The adhesion promoter compound may be a hydrolytic silane with at least one organic functional moiety. A method of forming conductive features on a substrate includes depositing a composition containing metal nanoparticles, an adhesion promoter compound and a solvent onto a substrate, and heating the deposited composition to a temperature from about 100°C to about 200°C.
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申请公布号 |
CA2695854(A1) |
申请公布日期 |
2010.09.12 |
申请号 |
CA20102695854 |
申请日期 |
2010.03.05 |
申请人 |
XEROX CORPORATION |
发明人 |
HU, NAN-XING;LIU, PING;WU, YILIANG |
分类号 |
C09D5/24;B05D1/00;B22F1/00;C09D1/00;H01B1/20;H01L21/288;H01L21/445;H05K3/10 |
主分类号 |
C09D5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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