| 摘要 |
[Problems] To provide a multi-layer printed wiring board without decrease in connection reliability by forming a filled via right above a filled via of a small radius. [Means of Solving the Problems] During a heat cycle, the stress applied to a filled via 60 formed on cover plated layers 36a and 36d is larger than the stress applied to a filled via 160 formed on the second interlayer resin insulation layer 150. Therefore, the bottom diameter d 1 of the filled via 60 is made larger than the bottom diameter d2 of the filled via 160 formed right above the filled via 60. |
