| 摘要 |
PURPOSE: A semiconductor package is provided to absorb heat generated during a semiconductor chip operation process by forming a plurality of thermal absorbing units in a molding part. CONSTITUTION: A semiconductor chip(106) is attached on a substrate(102). A plurality of bonding pads(108) is arranged on the upper side of the semiconductor chip. A connecting unit(110) electrically connects the semiconductor chip and the substrate. A molding unit(114) seals one side of the substrate including the semiconductor and the connecting unit. A thermal absorbing unit(112) is spaced apart from the semiconductor chip in the molding unit. The thermal absorbing unit is composed of a conductive material. |
