BUMP, METHOD FOR FORMING BUMP, AND METHOD FOR MOUNTING SUBSTRATE HAVING THE BUMP FORMED THEREON

摘要

Disclosed is a bump which has a double-layered structure comprising a first bump layer and a second bump layer, wherein the first bump layer is formed on a substrate and comprises a bulk of a first electrically conductive metal selected from gold, copper and nickel, and the second bump layer is formed on the first bump layer and comprises a sintered body of a powder of a second electrically conductive metal selected from gold and silver. The bulk that constitutes the first bump layer is formed by any one technique selected from a plating technique, a sputtering technique and a CVD technique. The sintered body that constitutes the second bump layer is formed by sintering a metal powder comprising the second electrically conductive metal, wherein the metal powder has a purity of 99.9% by weight or more and an average particle diameter of 0.005 to 1.0 µm. The second bump layer has a Young's modulus 0.1 to 0.4 time lower than that of the first bump layer.