摘要 |
The present invention relates to a device (10), a method and an application thereof for optically measuring the surface of a tested product (5), especially a PCB-product for reflow soldering paste inspection. The device comprises at least one white light source (1) for emitting a beam of white light, at least one collimation unit (4) for collimating said beam of white light (30), at least one spectrometer unit, preferably an optical prism (2) or an optical diffraction grading (51 ), for splitting said beam of white light (30) into a beam of multichromatic light (31) being directed onto said tested product (5) under a predetermined incident angle ?, and at least one camera (3) for recording a reflected beam of monochromatic light (32) of said tested product (5). Z-axis surface height information of said tested product (5) can be extracted from a hue value of said reflected beam of mono¬ chromatic light (32) while relatively moving said tested product (5) in a x-axis scanning direction (9).
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