| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problems wherein a chip position results in changes due to thermal influence, when heating, pressurizing and bonding a semiconductor chip and a circuit board in a chip bonding device, a bump is compressed and wrongly connected to a nearby connection position during heating and the bonded bump peels off during cooling. <P>SOLUTION: By performing thermal influence displacement measurements, preparing thermal displacement amount process, computing cancellation process and canceling chip displacement amount, and by holding a chip at a fixed position, discharge of defective products is prevented. <P>COPYRIGHT: (C)2010,JPO&INPIT |
