| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent defects, such as separation of edges of cores from insulation films, in packaging structures of electronic components including bump electrodes with structure, where a plurality of places along longitudinal directions on surfaces of resin, namely a core, are covered with conductive films made of metal, on the insulation film, and flexible substrates. <P>SOLUTION: The packaging structure 1 electrically connects the electronic component 4 having the bump electrode 23 with structure, where a plurality of places along longitudinal directions on the surface of the internal resin 24, namely a core, are covered with the conductive film 25 made of metal, on the insulation film 22 to the flexible substrate 2 having a metal terminal 12. The conductive film near an edge 24a of the inner resin 24 is expanded while covering the edge 24a to form a conductive film 25A having a large area, and an edge of the conductive film 25A having a large area is fixed to the insulation film 22. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
