| 摘要 |
A wiring board has a substrate with an opening section, an electronic component having an electrode and arranged in the opening section, insulative material filled in the gaps between the substrate and the electronic component in the opening section, and a first conductive layer formed on the insulative material and including a first conductive pattern. A via hole is formed in the insulative material. The electrode of the electronic component and the first conductive pattern are connected by means of the via hole. The height of the via hole is set in the range of 5-15μm and the aspect ratio of the via hole is set in the range of 0.07-0.33.
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