| 摘要 |
<P>PROBLEM TO BE SOLVED: To manufacture an MEMS which can be made compact and has small variations in characteristics. <P>SOLUTION: This method includes: forming a plurality of recessed parts in an annular region on a first principal surface of a substrate made of single-crystal silicon; forming an annular cavity in the substrate from the plurality of recessed parts, and also forming a thick part and a thin part which are partitioned by the cavity, and a column part enclosed with the cavity and coupling the thin part and thick part by heat-treating the substrate in a non-oxidizing atmosphere; and forming an annular groove reaching the cavity from a second principal surface of the substrate which corresponds to the reverse surface of the first principal surface to divide the thick part into a frame part positioned outside the annular groove and coupled with the thin part and a weight part positioned inside the annular groove and coupled with the column part. <P>COPYRIGHT: (C)2010,JPO&INPIT |
