发明名称 LEAD FRAME FOR OPTICAL SEMICONDUCTOR APPARATUS, AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To improve adhesiveness of resin with improving luminous efficiency. <P>SOLUTION: A base plating coat 3 that does not contain a surface smoothing agent is formed on a lead frame 2, and a silver plating coat 4 formed by using low-cyanogen silver plating solution is formed on the surface of the foundation plating coat 3. Thereby, precipitation of silver is facilitated with remaining lustrous. Accordingly, adhesiveness of resin is improved with improving luminous efficiency. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010199166(A) 申请公布日期 2010.09.09
申请号 JP20090040065 申请日期 2009.02.24
申请人 PANASONIC CORP 发明人 KONO KEISHI;TAKASAGO KOJI;KUSANO TOMIO;FUTAGAMI TOMOHIRO
分类号 H01L33/60;H01L23/50;H01L33/62 主分类号 H01L33/60
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