发明名称 ELECTRONIC COMPONENT MOUNTING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To reduce the operation time required for repairing a component supply unit where an abnormality occurs and correcting the abnormality, thereby improving the production efficiency of a printed board. <P>SOLUTION: An electronic component mounting apparatus includes a CPU which performs control in the following manner. When an abnormality occurs in the component supply unit during an operation of feeding an electronic component, the occurrence of the abnormality in the component supply unit is stored in a RAM, and the electronic component is taken out by means of suction nozzles in use provided in a mounting head. The electronic components held by all of the suction nozzles in the mounting head are mounted on the printed board. After that, the take-out position of the component supply unit where the abnormality occurred is photographed by a board recognition camera and the photographed image related to the abnormality is displayed on a monitor so as to stop the production operation of the printed board after the display. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010199445(A) 申请公布日期 2010.09.09
申请号 JP20090044915 申请日期 2009.02.26
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 ONISHI SEIJI;KAMEDA MAKIO;HASHIZUME SHO
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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