| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a metal surface treating agent for roughening a copper or copper alloy surface to a desired degree, being excellent in adhesiveness between a fine copper or copper alloy wiring and a photoresist (resin), and a method of treating a surface. Ž<P>SOLUTION: The metal surface treating agent contains hydrogen peroxide, an inorganic acid, an halide ion, and triazole or the like. In fine copper wiring, the adhesiveness between the copper wiring and the photoresist (resin), is excellent by roughening the copper or the copper alloy surface to the desired degree with the metal surface treating agent. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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