发明名称 |
Three-Dimensional System-in-Package Architecture |
摘要 |
A system and method for making semiconductor die connections with through-silicon vias (TSVs) are disclosed. A semiconductor die is manufactured with both via-first TSVs as well as via-last TSVs in order to establish low resistance paths for die connections between adjacent dies as well as for providing a low resistance path for feedthrough channels between multiple dies.
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申请公布号 |
US2010225002(A1) |
申请公布日期 |
2010.09.09 |
申请号 |
US20090631346 |
申请日期 |
2009.12.04 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LAW OSCAR M.K.;WU KUO H. |
分类号 |
H01L23/48;H01L21/768 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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