发明名称 APPARATUS FOR MANUFACTURING THIN FILM
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a thin film by which abnormal discharge caused between a flexible substrate and the frame body of earth potential can securely be suppressed. <P>SOLUTION: The flexible substrate 1 is conveyed to a vacuum chamber 13 for film deposition; a pair of holding members 33, 54 are arranged relatively movably with the carried flexible substrate 1 held; a grounding electrode 22 is arranged at either of the pair of holding members 33, 54; a high voltage electrode 21 is arranged at the other; the inside of the vacuum chamber 13 for film deposition is provided with a holding mechanism forming a film deposition chamber 5 and an actuator 24 driving the pair of holding members 33, 54 relatively movably; sealing members 52, 331 surrounding the film deposition face of the flexible substrate are arranged at the pair of holding members 33, 54 in the holding mechanism in the holding state of the flexible substrate 1; and further, an earth potential contact 56 contacted with the flexible substrate 1 at the outside of the sealing members and making the flexible substrate into earth potential is provided. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010196144(A) 申请公布日期 2010.09.09
申请号 JP20090045545 申请日期 2009.02.27
申请人 FUJI ELECTRIC HOLDINGS CO LTD 发明人 WADA KATSUHITO
分类号 C23C16/54;C23C16/50;H01L31/04 主分类号 C23C16/54
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