| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To apply an appropriate marking to an substrate even if the substrate is deflected or warped. <P>SOLUTION: In a marking method, firstly a substrate 200 is irradiated with a laser L from a laser head 104 while attenuating the laser L emitted from the laser head 104 to such a degree that marking is not executed on the substrate 200. By the irradiation, a distance d1 between the laser head 104 and the substrate 200 is measured at a position P2 where marking is to be executed (a first step). Secondly, the distance between the laser head 104 and the substrate 200 is adjusted to an appropriate distance d2 based on the distance d1 measured in the first step, and marking is executed by irradiating the laser L to the substrate 200 from the laser head 104 in a state of releasing attenuation of the laser L (a second step). <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
