| 摘要 |
PROBLEM TO BE SOLVED: To provide a connecting device, capable of further firmly connecting a lead terminal to an external circuit substrate through a flexible substrate; a package for housing a semiconductor element with flexible substrate; and the semiconductor element with flexible substrate. SOLUTION: The device includes a terminal block 6 having a first conductor wire 6a formed on an upper surface 61; a lead terminal 7 provided to protrude from the terminal block 6 and connected to the first conductor wire 6a; and a flexible substrate 8 including a through-hole H to which the lead terminal 7 is inserted, a conductive member 8a, provided on the inner circumferential surface of the through-hole H, and a connecting wire 8b connected to the conductive member 8a. The terminal block 6 includes a cutout part C formed by cutting an end surface 62 of the terminal block 6, and the cutout part C includes a second conductor wire 5a extended from the fist conductor wire 6a, and the lead terminal 7 and the conductive member 8a and the second conductor wire 6b are connected, respectively, by connecting members 9. COPYRIGHT: (C)2010,JPO&INPIT
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