发明名称 |
SEMICONDUCTOR PACKAGE HAVING AN INTERNAL COOLING SYSTEM |
摘要 |
A semiconductor package having an internal cooling system is presented which includes a semiconductor chip and a through-electrode. The semiconductor chip has a circuit section. The through-electrode passes through an upper surface and a lower surface the semiconductor chip. The through-electrode is electrically connected with the circuit section of the semiconductor chip. The through-electrode also has a through-hole for allowing cooling fluid to flow therethrough.
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申请公布号 |
US2010224990(A1) |
申请公布日期 |
2010.09.09 |
申请号 |
US20090639222 |
申请日期 |
2009.12.16 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
SUH MIN SUK;PARK CHANG JUN |
分类号 |
H01L23/34;H01L23/538;H01L25/065 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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