Soldering pipe into hole, by inserting pipe enclosed in laminate of solder material and exothermic reactive material layers into hole and expanding pipe to initiate exothermic reaction

摘要

A method for soldering the outer surface (2) of a pipe (1) to the area of a hole (3) uses a laminate of solder material layer(s) (5) and exothermic reactive material layer(s) (6), applied between the two surfaces. The pipe outer diameter (including a double thickness of laminate around the double thickness of a gap (7)) is less than the hole inner diameter. The pipe is inserted into the hole, then expanded under internal pressure to initiate exothermic reaction in the reactive material. An independent claim is included for a reactive material for carrying out the process (where exothermic reaction is initiated when the internal pressure for closing the gap (7) is exceeded), in which reaction is initiated on exceeding a specific pressure.