| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component that reduces stress applied to a functional element. <P>SOLUTION: The electronic component has at least a part of the functional elements 1 disposed in a sealed space K formed between one substrate P and the other substrate 1, and includes a sealing thin film 2 for maintaining the environment in the sealed space K. The sealing thin film is a very thin member and formed through low-temperature processes, so that even when there is a difference between the coefficient of thermal expansion of the sealing thin film and the coefficient of expansion of the substrates, stress applied to the functional element due to the difference of the coefficient of thermal expansion can be reduced as much as possible. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
