发明名称 |
LAMINATED BOARD FOR PRINTED WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a laminated board for a printed wiring board suitable for high-speed communication. SOLUTION: The laminated board for the printed wiring board includes a reinforcing fiber base material formed of melting anisotropic polyester amide fiber which is composed of aromatic polyester amide in which a portion formed of a plurality of repetitive constitutive units is 90 mol% or more and each of the repetitive constitutive units has a molar ratio of 100:1-20:5-100:2-80:2-20, and which has a strength (T<SB>150</SB>) in a 150°C atmosphere being 17 cN/dtex or more and an elastic modulus (E<SB>150</SB>) in the 150°C atmosphere being 710 cN/dtex or more. COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010199437(A) |
申请公布日期 |
2010.09.09 |
申请号 |
JP20090044658 |
申请日期 |
2009.02.26 |
申请人 |
KURARAY CO LTD |
发明人 |
KATAYAMA TAKASHI;INADA SHINYA;HITOMI YOSHINORI;OMAE YOSHINOBU;UEHATA AKIHIRO |
分类号 |
H05K1/03;B32B15/08;C08G69/44;H05K3/46 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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