发明名称 LAMINATED BOARD FOR PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a laminated board for a printed wiring board suitable for high-speed communication. SOLUTION: The laminated board for the printed wiring board includes a reinforcing fiber base material formed of melting anisotropic polyester amide fiber which is composed of aromatic polyester amide in which a portion formed of a plurality of repetitive constitutive units is 90 mol% or more and each of the repetitive constitutive units has a molar ratio of 100:1-20:5-100:2-80:2-20, and which has a strength (T<SB>150</SB>) in a 150°C atmosphere being 17 cN/dtex or more and an elastic modulus (E<SB>150</SB>) in the 150°C atmosphere being 710 cN/dtex or more. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010199437(A) 申请公布日期 2010.09.09
申请号 JP20090044658 申请日期 2009.02.26
申请人 KURARAY CO LTD 发明人 KATAYAMA TAKASHI;INADA SHINYA;HITOMI YOSHINORI;OMAE YOSHINOBU;UEHATA AKIHIRO
分类号 H05K1/03;B32B15/08;C08G69/44;H05K3/46 主分类号 H05K1/03
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