| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling structure for stably cooling a mounted component having a plurality of electrodes on a surface opposed to a board. SOLUTION: The cooling structure is mounted on a printed board 20 to cool a ball grid array (BGA) element 10 including a plurality of solder balls 15 on a surface opposed to the printed board 20. The printed board 20 has an opening 21 penetrating in a region opposed to the BGA element 10 from the surface where the BGA element 10 is mounted toward the rear surface. A piezoelectric blower 30 including a discharge port 32 for discharging air from the opening 21 to the component where the BGA element 10 is mounted is located on the rear surface of the printed board 20. An annular member 40 contacting with the printed board 20 and the piezoelectric blower 30 in an annular manner is provided in a position surrounding the discharge port 32. COPYRIGHT: (C)2010,JPO&INPIT |
