发明名称 SHEET PEELING DEVICE AND PEELING METHOD
摘要 PROBLEM TO BE SOLVED: To facilitate peeling of an adhesive sheet at an early stage. SOLUTION: A sheet peeling device 10 includes: an irradiation means 12 for irradiating an energy ray to an energy ray curable adhesive sheet S which is adhered to a wafer W; a mask means 13 that partially coats the adhesive sheet S and is capable of forming a mask region MA, to which the energy ray from the irradiation means 12 is not irradiated, on the adhesive sheet S; an adhering means 19 for adhering a peeling tape PT to the adhesive sheet S; and a single axis robot 18 for relatively moving the peeling tape PT adhered to the adhesive sheet S with respect to the wafer W to peel the adhesive sheet S. The mask region MA is formed by the mask means 13 in a region located at an outer edge side of the wafer W and in which the peeling tape PT is adhered. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010199466(A) 申请公布日期 2010.09.09
申请号 JP20090045088 申请日期 2009.02.27
申请人 LINTEC CORP 发明人 TAKANO TAKESHI
分类号 H01L21/683;H01L21/304 主分类号 H01L21/683
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