| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board reducing crosstalk generated between parallel signal wires, and to suppress generation of ground bounce. Ž<P>SOLUTION: The wiring board includes a first insulating layer 1, a second insulating layer 2 laminated on a lower surface of the first insulating layer 1, a plurality of band-shaped signal wires 3 extended in parallel to each other between the first insulating layer 1 and second insulating layer 2, a first conductor layer 4 arranged on an upper surface of the first insulating layer 1 to cover an area opposite to the plurality of signal wires 3, and a second conductor layer 5 arranged on a lower surface of the second insulating layer 2 to cover an area opposite to the plurality of signal wires 3. At least one of the first conductor layer 4 and second conductor layer 5 includes a plurality of oval or rectangular slits intermittently extending along the signal wires 3 in positions corresponding to in-betweens of the signal wires 3. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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