发明名称 Integrated Circuit with Ribtan Interconnects
摘要 An integrated circuit (IC) includes an interconnect system made of electrically conducting ribtan material. The integrated circuit includes a substrate, a set of circuit elements that are formed on the substrate, an interconnect system that interconnects the circuit elements. At least part of the interconnect system is made of a metallic ribtan material.
申请公布号 US2010224998(A1) 申请公布日期 2010.09.09
申请号 US20090492125 申请日期 2009.06.25
申请人 CARBEN SEMICON LIMITED 发明人 DUVALL STEVEN GRANT;KHOKHLOV PAVEL;LAZAREV PAVEL I.
分类号 H01L23/532;H01L21/768 主分类号 H01L23/532
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