| 摘要 |
An improved LED assembly is disclosed comprising a circuit substrate and a frame. The circuit substrate has LEDs, conductive strips and a cover. The conductive strips are connected to the positive lead and negative lead of the LED. The cover has at least one opening and at least one bump on the surface, which helps the movement of the circuit substrate. The frame has an open end on the upper surface of the frame and extended along two sides of the open end horizontally further comprising two positioning structures in order to form a slot on the inner side of the frame. And conductive elements are formed on the inner side of the two positioning structures toward the slot so as to conduct the electric source to the circuit substrate and dissipate the heat. |
