| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical semiconductor device that achieves highly efficient light emission. <P>SOLUTION: The optical semiconductor device 10 includes a pair of leads 11, a mold 14 which is molded integrally with the leads 11 and has a recess 14a formed on the upper surface of the mold 14 to expose the leads 11, an optical semiconductor element 15 placed on the leads 11 in the recess 14a, and a sealing resin filling the recess 14a of the mold 14. The lead 11 exposes part of its side from the mold 14 to cause the exposed part to serve as a terminal, and has a step on the backside of the lead 11 that is adjacent to the terminal. <P>COPYRIGHT: (C)2010,JPO&INPIT |
