发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To inhibit generation of development spots by efficiently and smoothly performing operation which separates and collects first treatment liquid supplied to a substrate to be treated on a transfer line of flat flow and replaces the first treatment liquid with second treatment liquid. Ž<P>SOLUTION: A substrate processing apparatus comprises: a substrate transfer path 2 through which a substrate G to be treated is transferred so as to flow flatly; a first treatment liquid supply means 9 which supplies the first treatment liquid to the substrate to be treated which is transferred through the substrate transfer path; a gas supply means 21 which sprays predetermined gas flow, toward either vertical direction or transfer direction downstream side, on the substrate to be treated which is transferred through the substrate transfer path and to which the first treatment liquid is supplied; a first rinse means 22 which supplies the second treatment liquid, by a predetermined flow velocity, on the substrate to be treated on which the gas flow is sprayed by the gas supply means, and which is transferred through the substrate transfer path; and a second rinse means 23 which supplies the second treatment liquid, by a high flow velocity higher than that of the first rinse liquid supply means, on the substrate to be treated on which the second treatment liquid is supplied and which is transferred through the substrate transfer path. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010199150(A) 申请公布日期 2010.09.09
申请号 JP20090039683 申请日期 2009.02.23
申请人 TOKYO ELECTRON LTD 发明人 FUJIWARA MAKI;NAGATA ATSUSHI;SADA TETSUYA
分类号 H01L21/304;B65G49/06;H01L21/027;H01L21/677 主分类号 H01L21/304
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