| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a forced air-cooled heat sink which can reduce the load on an air-exchange means, such as, fan and which can be manufactured at low cost. Ž<P>SOLUTION: In an interdigital heat sink, a plurality of planar fins are arranged into an interdigital shape, in a planar base plate 11. A part of the fins is a fixed fin 12, which is fixed to the base plate, and another part of the fins, is a movable fin 13. The fixed fin 12 and the movable fin 13 are connected by a bimetal 14. While a chip is at a relatively low temperature, the movable fin 13 is moved to the vicinity of the fixed fin, to avoid load on an air exchange means. Meanwhile, at a high temperature, the movable fin 13 is moved to the vicinity of a center between the fixed fins 12 and the movable fin 13, and the fin is set in a state with narrowed air circulation path and enhanced the heat dissipation efficiency. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
