| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a new photosensitive resin composition to be used for a reflow or resist peeling process during the back-end-of-line in a semiconductor manufacturing process, and to provide a method for producing a cured relief pattern by using the composition, the pattern having sufficient durability against a flux or a solvent and having no angular portion in a side wall feature. <P>SOLUTION: The photosensitive resin composition contains (A) 100 pts.mass of a hydroxy polyamide including a structure expressed by general formula (1), (B) 1 to 100 pts.mass of a diazoquinone compound, (C) a compound having an oxetanyl group, and (D) a thermal crosslinking agent, wherein the total content of (C) the compound containing an oxetanyl group and (D) the thermal crosslinking agent ranges from 20 to 50 pts.mass, and the mass ratio of (D) the thermal crosslinking agent to (C) the compound having an oxetanyl group ranges from 0.06 to 0.67. <P>COPYRIGHT: (C)2010,JPO&INPIT |
