| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring substrate structure for reducing the size of an apparatus incorporating a wiring substrate. Ž<P>SOLUTION: The wiring substrate structure includes a wiring substrate G having flexibility, and a substrate holding member 62a that is provided to bend the wiring substrate G with a prescribed curvature and hold the bent condition. The wiring substrate G includes a bend 166 having the prescribed curvature, and a first portion and a second portion that sandwich the bend therebetween. The substrate holding member 62a includes a first holding member 152a secured to the first portion, a second holding member 152b secured to the second portion, and a connecting portion that connects the first holding member 152a and the second holding member 152b so as not to change the positional relationship between the first and second holding members. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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