| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the following problem: when mechanical stress or thermal stress is applied to a semiconductor element having a two-dimensional code formed on a surface, the semiconductor element may crack. Ž<P>SOLUTION: The semiconductor element 2 has a cleavage surface 3 on a side surface, and also has the two-dimensional code 6 formed on the surface. The two-dimensional code 6 is a matrix code where unit cells 8 which are in a quadrangular shape on the surface of the semiconductor element 2 are formed to be projected or recessed from the surface, sides constituting the unit cells 8 being inclined to the cleavage surface 3. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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