| 摘要 |
<P>PROBLEM TO BE SOLVED: To three-dimensionally locate failure places of a device to be tested. Ž<P>SOLUTION: A failure analyzer 70 includes: a laser irradiation means for irradiating a semiconductor device (DUT) 21 which is a device to be tested with laser beams and heating a specific place of the device to be tested irradiated with laser beams to generate a thermoelectromotive current; a photographing means for photographing an optical heating resistance change image of the device to be tested by scanning the device horizontally and vertically by the laser beams; a first position coordinates setting means for overlapping the horizontal optical heating resistance change image to a planar layout image of the device to be tested so that horizontal position coordinates become identical; and a second position coordinates setting means for overlapping vertical optical stage position information with section information of the device to be tested so that vertical position coordinates become identical. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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