| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a module substrate capable of reducing interference of noise components, in a predetermined high-frequency band, passed through a power source between a plurality of circuits provided side by side in a substrate. <P>SOLUTION: The module substrate includes: a positive electrode line 31 for connecting a supply-side positive electrode layer 11 and a consumption-side positive electrode layer 21 of a power source when the plurality of circuits provided side by side in the substrate 100 share the power source; a supply-side positive electrode via 41 connecting the supply-side positive electrode layer 11 and the positive electrode line 31; a consumption-side positive electrode via 51 connecting the consumption-side positive electrode layer 21 and positive electrode 31; a negative electrode line 32 connecting a supply-side negative electrode layer 12 and a consumption-side negative electrode layer 22; a supply-side negative electrode via 42 connecting the supply-side negative electrode layer 12 and negative electrode line 32; a consumption-side negative electrode via 52 connecting the consumption-side negative electrode layer 22 and negative electrode line 32; a supply-side positive electrode open stub 61 where the supply-side positive electrode via 41 is formed in a length exceeding the supply-side positive electrode layer 11; and a consumption-side positive electrode open stub 71 where the consumption-side positive electrode via 51 is formed in a length exceeding the consumption-side positive electrode layer 21. <P>COPYRIGHT: (C)2010,JPO&INPIT |
