发明名称 |
RESIN COMPOSITION, RESIST COMPOSITION, AND FORMATION METHOD FOR RESIST PATTERN |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resist composition being excellent in photo-sensitivity, having less side etching and being excellent in etching-resistance at a thin film, especially etching-resistance under an etching condition using an etching liquid of a strong acid. <P>SOLUTION: The resin composition contains an unsaturated group-containing polycarboxylic acid resin (A) obtained by reacting a saturated or unsaturated polybasic acid anhydride (c) and a compound (d) having an ethylenic unsaturated group and an isocyanate group with a product (I) obtained by reacting an epoxy compound (a) having two or more epoxy groups in one molecule obtained by reacting a bisphenol type epoxy resin (a1), a bisphenol based compound (a2) with an epoxy resin (a3) other than the above (a1) with a compound (b) having one or more hydroxyl groups and one carboxyl group in the molecule. The resist composition and the resist pattern formation method using the resin composition are provided. <P>COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010195860(A) |
申请公布日期 |
2010.09.09 |
申请号 |
JP20090039466 |
申请日期 |
2009.02.23 |
申请人 |
KANSAI PAINT CO LTD |
发明人 |
IWASHIMA TOMOAKI;YAMADA NORIYUKI |
分类号 |
C08G59/14;C08F290/00;G03F7/027 |
主分类号 |
C08G59/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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