| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a sensor device, capable of preventing any resin burr and any crack fault of a sensor chip which accompany molding, capable of firmly fixing the sensor chip, and capable of preventing problems such as corrosion, leakage and the like which arise through an ambient atmosphere to be measured, and to provide a method of manufacturing the same. <P>SOLUTION: The sensor device 100 is configured such that a plurality of middle leads 20a are disposed to electrically connect the sensor chip 2b with a circuit chip 11b, and a mold resin 7b is disposed so as to cover the circuit chip 11b, a first wire 30b and a connecting part of a first edge part T1 and the first wire 30b except for both sides of a mold die gripping part KH, and the mold die gripping part KH is connected to the sensor chip 2b by a second wire 30a, and an insulating protection agent 61 is disposed so as to cover the second wire 30a, a connecting part of the sensor chip 2b and the second wire 30a, and a connecting part of the mold die gripping part KH and the second wire 30a. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
