| 摘要 |
PROBLEM TO BE SOLVED: To further improve grinding productivity by eliminating the need for dressing of a grinding wheel during grinding of a workpiece such as a semiconductor wafer. SOLUTION: In a method of grinding the workpiece by operating the grinding wheel 213b with respect to the workpiece held on a chuck table 20 while supplying a grinding fluid from a grinding fluid supply means 22 to the grinding wheel 213b, the grinding wheel 213b is a vitrified grinding wheel obtained by bonding together diamond abrasive grains with a vitrified bond, and the grinding fluid supplied from the grinding fluid supply means 22 is a silicon dioxide solution that facilitates self-sharpening action of the grinding wheel by eroding the vitrified bond. COPYRIGHT: (C)2010,JPO&INPIT |
