| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which high-frequency chips, memory chips, and the like, are mixed-mounted in the same package, and the effects of a high frequency noise and a power source variation noise are controlled. <P>SOLUTION: The semiconductor device includes: a wiring board 2; a first semiconductor chip 6 mounted on the wiring board 2; a second semiconductor chip 9 laminated on the first semiconductor chip 6; a conductor coat chip 21 inserted between the first semiconductor chip 6 and the second semiconductor chip 9; and a wire 23c for electrically connecting the second semiconductor chip 9 with the conductor coat chip 21. <P>COPYRIGHT: (C)2010,JPO&INPIT |
