| 摘要 |
A probe card 4 connected with an evaluation unit for evaluating a characteristic of a microstructure formed on a wafer 8 by outputting a test sound wave to a movable section 16a of the microstructure, includes: a probe 4a, which is electrically connected with an inspection electrode of the microstructure formed on the wafer 8, for detecting, in a test, an electric variation based on a movement of the movable section 16a formed on the wafer 8; and at least one of a sound absorber 11, a blocking portion 18 and a horn 19 for suppressing a reflection or an interference of the test sound wave. A diffusion portion may be provided instead of or additional to the sound absorber 11. Further, a microstructure inspecting apparatus includes the probe card 4 having the sound absorber 11, the blocking portion 18 or the horn 19.
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