| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which can be suitably used for manufacturing flexible printed wiring boards and build-up wiring boards, and provides a cured resin by curing, on a surface of which resin a plating metal layer strongly adhered to the surface can be formed, where adhesive force (adhesion strength) with the plating metal is hardly reduced even in a high temperature and high humidity atmosphere, to provide a laminated material, and to provide a printed wiring board. SOLUTION: In the thermosetting resin composition including (A) a curing agent component containing at least one kind of imide compound component and (B) an epoxy resin component containing at least one kind of epoxy resin, the imide compound component contains an imide compound having an amino group of a specific structure at the terminal and (B) the epoxy resin component contains an epoxy resin having a specific structure. COPYRIGHT: (C)2010,JPO&INPIT |
