发明名称 |
Method for Arranging a Powder Layer on a Substrate and Layer Structure with at least One Powder Layer on a Substrate |
摘要 |
A process for arranging a powder layer comprising a powder on a substrate surface of a substrate. A substrate having a substrate surface is provided, and a mixture comprising the powder and an adhesion promoter is applied on the substrate surface. The adhesion promoter is removed and the powder layer is fixed on the substrate surface.
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申请公布号 |
US2010224893(A1) |
申请公布日期 |
2010.09.09 |
申请号 |
US20070303928 |
申请日期 |
2007.06.06 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
LIEPOLD UTE |
分类号 |
H01L33/44;B05D5/12;B05D7/24;B32B5/16;C23C26/00;C25D1/12;H01L33/50 |
主分类号 |
H01L33/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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